Electronic device package
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United States of America Patent
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Oct 17, 2006
Issued Date -
N/A
app pub date -
Feb 1, 2001
filing date -
Feb 1, 2001
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An electronic device package comprises a substrate, a die, and a material having a Young's modulus of between about 0.1 megapascals and about 20 megapascals (at a solder reflow temperature) for attaching the die to the substrate. In one embodiment, the package utilizes a material having a Young's modulus of between about 0.1 megapascals and about 20 megapascals (at a solder reflow temperature) for attaching the die to the substrate. In an alternate embodiment, the package utilizes a material having a coefficient of thermal expansion .alpha..sub.2 of less than about 400 (four-hundred) ppm (parts per million)/.degree. C. for attaching the die to the substrate. In another alternate embodiment, the package utilizes a rigid material for attaching the die to the substrate.
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