Brazed wick for a heat transfer device
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United States of America Patent
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Oct 24, 2006
Issued Date -
N/A
app pub date -
Apr 6, 2005
filing date -
Jun 26, 2003
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A capillary structure for a heat transfer device, such as a heat pipe is provided having a plurality of particles joined together by a brazing compound such that fillets of the brazing compound are formed between adjacent ones of the plurality of particles. In this way, a network of capillary passageways are formed between the particles to aid in the transfer of working fluid by capillary action, while the plurality of fillets, provide enhanced thermal transfer properties between the plurality of particles so as to greatly improve over all heat transfer efficiency of the device.
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