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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
EBARA TECHNOLOGIES INCORPORATED	51 MAIN AVENUE SACRAMENTO CA 95838

International Classification(s)

• B24D:TOOLS FOR GRINDING, BUFFING, OR SHARPENING

• [Classification Symbol]

• [Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Liu, Jun	Cupertino, CA	1497	18125
Moloney, Gerard	Milpitas, CA	5	59
Saldana, A Ernesto	San Jose, CA	1	6
Walsh, Cormac	Sunnyvale, CA	4	42

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
October 24, 2006	US,7125326,B2   US7125326B2	GRANTED PATENT AS SECOND PUBLICATION
December 15, 2005	US,20050277368,A1   US20050277368A1	FIRST PUBLISHED PATENT APPLICATION

Full Text

US Patent No: 7125326

Apparatus and method for removing a CMP polishing pad from a platen

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