Miniaturized contact spring
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United States of America Patent
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Oct 24, 2006
Issued Date -
N/A
app pub date -
Mar 17, 2003
filing date -
Mar 18, 2002
priority date (Note) -
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Abstract
This invention provides a solution to increase the yield strength and fatigue strength of miniaturized springs, which can be fabricated in arrays with ultra-small pitches. It also discloses a solution to minimize adhesion of the contact pad materials to the spring tips upon repeated contacts without affecting the reliability of the miniaturized springs. In addition, the invention also presents a method to fabricate the springs that allow passage of relatively higher current without significantly degrading their lifetime.
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