Real-time mathematical model for wafer spin defect detection and for misalignment analyses
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United States of America Patent
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Oct 24, 2006
Grant Date -
Sep 21, 2006
app pub date -
Mar 1, 2005
filing date -
Mar 1, 2005
priority date (Note) -
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Abstract
According to various embodiments, there is a method of inspecting semiconductor wafers comprising comparing a value for each wafer in a lot of wafers to a mathematical model, where the values include data about at least one feature on the wafers, and where the mathematical model comprises a threshold value corresponding to the at least one feature, and further where values greater than the threshold value comprise an indication of a spin defect. The method can also comprise determining whether any of the values of the wafers in the lot are not greater than the threshold value, grouping into a group (P) those wafers whose values are not greater than the threshold value, and flagging for further inspection those wafers having values greater than the threshold value.
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