Metal/ceramic circuit board and method for producing same
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United States of America Patent
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Oct 31, 2006
Issued Date -
N/A
app pub date -
May 27, 2004
filing date -
May 30, 2003
priority date (Note) -
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Abstract
A metal layer 12 of aluminum or an aluminum alloy is formed on at least one side of a ceramic substrate 10, and a resist 14 having a predetermined shape is formed on the metal layer 12. Then, an etchant of a mixed solution prepared by mixing ferric chloride with water without adding any acids is used for etching and removing an undesired portion of the metal layer 12 to form a metal circuit 12 on the at least one side of the ceramic substrate 10.
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