Method of making a three-dimensional stacked semiconductor package with a metal pillar in an encapsulant aperture
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Oct 31, 2006
Issued Date -
N/A
app pub date -
Oct 22, 2004
filing date -
Oct 13, 2000
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method of making a three-dimensional stacked semiconductor package includes providing a first semiconductor chip assembly that includes a first chip, a first conductive trace and a first encapsulant, wherein the first conductive trace includes a first metal pillar, providing a second semiconductor chip assembly that includes a second chip, a second conductive trace and a second encapsulant, wherein the second encapsulant includes a second aperture, and then positioning the first and second assemblies such that the first assembly overlaps the second assembly and the first metal pillar extends into the second aperture.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully