Semiconductor chip assembly with bumped metal pillar

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO

7129575

SERIAL NO

10994604

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line, a bumped terminal and a metal pillar, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The routing line is contiguous with the bumped terminal and extends laterally beyond the bumped terminal and the metal pillar, and the metal pillar contacts and extends vertically beyond the bumped terminal.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
BRIDGE SEMICONDUCTOR CORPORATIONTAIPEI88

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chiang, Cheng-Lien Taipei, TW 55 1052
Lin, Charles W C Singapore, SG 175 2044

Cited Art Landscape

Patent Info (Count) # Cites Year
 
SONY CORPORATION (1)
6504241 Stackable semiconductor device and method for manufacturing the same 67 1999
 
MULTEK FLEXIBLE CIRCUITS, INC. (2)
5261593 Direct application of unpackaged integrated circuit to flexible printed circuit 154 1992
5615477 Method for interconnecting a flip chip to a printed circuit substrate 185 1996
 
SAMSUNG ELECTRONICS CO., LTD. (4)
4984358 Method of assembling stacks of integrated circuit dies 171 1990
5407864 Process for mounting a semiconductor chip and depositing contacts into through holes of a circuit board and of an insulating interposer and onto the chip 126 1993
5744827 Three dimensional stack package device having exposed coupling lead portions and vertical interconnection elements 176 1996
6608371 Semiconductor device and method of manufacturing the same, circuit board, and electronic equipment 147 2001
 
HITACHI, LTD. (2)
5595943 Method for formation of conductor using electroless plating 100 1995
5870289 Chip connection structure having diret through-hole connections through adhesive film and wiring substrate 266 1995
 
EPOXY TECHNOLOGY, INC. (3)
5074947 Flip chip technology using electrically conductive polymers and dielectrics 216 1989
5196371 Flip chip bonding method using electrically conductive polymer bumps 193 1991
5237130 Flip chip technology using electrically conductive polymers and dielectrics 164 1991
 
AMKOR TECHNOLOGY, INC. (3)
5478007 Method for interconnection of integrated circuit chip and substrate 132 1994
6281568 Plastic integrated circuit device package and leadframe having partially undercut leads and die pad 337 1998
6303997 Thin, stackable semiconductor packages 356 1999
 
ELECTRO SCIENTIFIC INDUSTRIES, INC. (1)
5614114 Laser system and method for plating vias 141 1994
 
RENESAS ELECTRONICS CORPORATION (1)
5666008 Flip chip semiconductor device 97 1996
 
KABUSHIKI KAISHA TOSHIBA (9)
4807021 Semiconductor device having stacking structure 314 1987
4970571 Bump and method of manufacturing the same 135 1988
5654584 Semiconductor device having tape automated bonding leads 78 1994
5556814 Method of forming wirings for integrated circuits by electroplating 82 1995
5556810 Method for manufacturing a semiconductor device wherein a semiconductor chip is connected to a lead frame by metal plating 88 1995
5536973 Semiconductor device including a semiconductor element mounted on a substrate using bump-shaped connecting electrodes 95 1995
5648686 Connecting electrode portion in semiconductor device 98 1995
5665652 Method for manufacturing a semiconductor device wherein electrodes on a semiconductor chip are electrically connected to lead terminals by plating bonding 92 1996
5801447 Flip chip mounting type semiconductor device 92 1996
 
BELL TELEPHONE LABORATORIES, INCORPORATED (2)
4717066 Method of bonding conductors to semiconductor devices 129 1986
4937653 Semiconductor integrated circuit chip-to-chip interconnection scheme 255 1988
 
Advanced Semiconductor Assembly Technology (1)
5397921 Tab grid array 336 1993
 
RAYTHEON COMPANY (1)
5817541 Methods of fabricating an HDMI decal chip scale package 134 1997
 
INVENSAS CORPORATION (2)
5487218 Method for making printed circuit boards with selectivity filled plated through holes 195 1994
5611140 Method of forming electrically conductive polymer interconnects on electrical substrates 152 1995
 
RYODEN KASEI CO., LTD. (50% INTEREST) (1)
5327010 IC card having adhesion-preventing sheets 83 1990
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (10)
5137845 Method of forming metal contact pads and terminals on semiconductor chips 171 1991
5209817 Selective plating method for forming integral via and wiring layers 191 1991
5483421 IC chip attachment 177 1992
5275330 Solder ball connect pad-on-via assembly process 168 1993
5542601 Rework process for semiconductor chips mounted in a flip chip configuration on an organic substrate 113 1995
5691041 Socket for semi-permanently connecting a solder ball grid array device using a dendrite interposer 296 1995
5822856 Manufacturing circuit board assemblies having filled vias 166 1996
5883435 Personalization structure for semiconductor devices 206 1996
5798285 Method of making electronic module with multiple solder dams in soldermask window 119 1997
6127204 Column grid array or ball grid array pad on via 81 1998
 
PALOMAR TECHNOLOGIES, INC. (1)
5364004 Wedge bump bonding apparatus and method 86 1993
 
AT&T IPM CORP. (1)
5477933 Electronic device interconnection techniques 276 1994
 
LSI LOGIC CORPORATION (3)
5438477 Die-attach technique for flip-chip style mounting of semiconductor dies 159 1993
5489804 Flexible preformed planar structures for interposing between a chip and a substrate 191 1993
5572069 Conductive epoxy grid array semiconductor packages 79 1995
 
LUCENT TECHNOLOGIES INC. (2)
5619791 Method for fabricating highly conductive vias 91 1995
6013877 Solder bonding printed circuit boards 104 1998
 
U.S. PHILIPS CORPORATION (1)
4442967 Method of providing raised electrical contacts on electronic microcircuits 87 1982
 
NETWORK PROTECTION SCIENCES, LLC (1)
5627406 Inverted chip bonded module with high packaging efficiency 127 1996
 
Siliconix Incorporated (1)
5757081 Surface mount and flip chip technology for total integrated circuit isolation 151 1996
 
VISTEON GLOBAL TECHNOLOGIES, INC. (1)
5669545 Ultrasonic flip chip bonding process and apparatus 104 1996
 
GLOBALFOUNDRIES INC. (1)
5774340 Planar redistribution structure and printed wiring device 192 1996
 
NATIONAL SCIENCE COUNCIL (1)
5583073 Method for producing electroless barrier layer and solder bump on chip 104 1995
 
FUJITSU LIMITED (5)
5284796 Process for flip chip connecting a semiconductor chip 172 1992
5334804 Wire interconnect structures for connecting an integrated circuit to a substrate 178 1992
5454161 Through hole interconnect substrate fabrication process 172 1993
5475236 Semiconductor chip for mounting on a semiconductor package substrate by a flip-clip process 148 1995
5722162 Fabrication procedure for a stable post 89 1995
 
Hughes Aircraft Company (1)
5525065 Cavity and bump interconnection structure for electronic packages 92 1995
 
MOTOROLA, INC. (2)
4661192 Low cost integrated circuit bonding process 153 1985
5576052 Method of metallizing high aspect ratio apertures 118 1996
 
FLIPCHIP INTERNATIONAL (2)
5547740 Solderable contacts for flip chip integrated circuit devices 136 1995
5803340 Composite solder paste for flip chip bumping 100 1995
 
INTERSIL AMERICAS LLC (1)
5646067 Method of bonding wafers having vias including conductive material 286 1995
 
ROUND ROCK RESEARCH, LLC (5)
5663598 Electrical circuit bonding interconnect component and flip chip interconnect bond 86 1995
5674785 Method of producing a single piece package for semiconductor die 381 1995
5739585 Single piece package for semiconductor die 467 1996
5811879 Stacked leads-over-chip multi-chip module 201 1997
6072233 Stackable ball grid array package 345 1998
 
National Semiconductor Corporation (2)
5508229 Method for forming solder bumps in semiconductor devices 142 1994
5627405 Integrated circuit assembly incorporating an anisotropic elecctrically conductive layer 113 1995
 
INTEL CORPORATION (3)
5757071 C4 substrate contact pad which has a layer of Ni-B plating 81 1996
6020561 Printed circuit substrate with solder formed on pad-on-via and pad-off-via contacts thereof 111 1996
6046909 Computer card with a printed circuit board with vias providing strength to the printed circuit board 99 1998
 
F&K DELVOTEC BONDTECHNIK GMBH (1)
4925083 Ball bonding method and apparatus for performing the method 74 1988
 
TEXAS INSTRUMENTS INCORPORATED (2)
5613296 Method for concurrent formation of contact and via holes 90 1995
5744859 Semiconductor device 126 1996
 
Grumman Aerospace Corporation (2)
5493096 Thin substrate micro-via interconnect 143 1994
5599744 Method of forming a microcircuit via interconnect 111 1995
 
W. L. GORE & ASSOCIATES, INC. (1)
6018196 Semiconductor flip chip package 141 1999
 
DENSE-PAC MICROSYSTEMS, INC. (1)
6180881 Chip stack and method of making same 217 1998
 
CASIO COMPUTER CO., LTD. (1)
5925931 Semiconductor device having interconnect lines and connection electrodes formed in groove portions of an insulating layer 209 1997
 
MATSUSHITA ELECTRONICS CORPORATION (1)
5172851 Method of forming a bump electrode and manufacturing a resin-encapsulated semiconductor device 102 1991
 
TYCO INTERNATIONAL (PA), INC., A CORPORATION OF NEVADA (1)
4955523 Interconnection of electronic components 202 1988
 
SEIKO EPSON CORPORATION (1)
6483718 Semiconductor device and method of manufacture thereof, circuit board, and electronic instrument 62 2001
 
AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD. (1)
5764486 Cost effective structure and method for interconnecting a flip chip with a substrate 110 1996
 
MICRON TECHNOLOGY, INC. (6)
5789271 Method for fabricating microbump interconnect for bare semiconductor dice 162 1996
5808360 Microbump interconnect for bore semiconductor dice 138 1996
5736456 Method of forming conductive bumps on die for flip chip applications 236 1996
5804771 Organic substrate (PCB) slip plane "stress deflector" for flip chip deivces 101 1996
6084781 Assembly aid for mounting packaged integrated circuit devices to printed circuit boards 128 1998
6084297 Cavity ball grid array apparatus 200 1998
 
FREESCALE SEMICONDUCTOR, INC. (3)
5293067 Integrated circuit chip carrier 122 1992
5439162 Direct chip attachment structure and method 128 1993
5424245 Method of forming vias through two-sided substrate 194 1994
 
VLSI Technology, Inc. (1)
5260234 Method for bonding a lead to a die pad using an electroless plating solution 104 1991
 
COBHAM DEFENSE ELECTRONIC SYSTEMS CORPORATION (1)
5454928 Process for forming solid conductive vias in substrates 92 1994
 
TEIJIN LIMITED (1)
5355283 Ball grid array with via interconnection 403 1993
 
LG SEMICON CO., LTD. (1)
5863816 Fabrication method for chip size semiconductor package 79 1997
 
MASSACHUSETTS INSTITUTE OF TECHNOLOGY (1)
5106461 High-density, multi-level interconnects, flex circuits, and tape for tab 282 1990
 
NEC CORPORATION (4)
5358621 Method of manufacturing semiconductor devices 120 1992
5633204 Method and apparatus for forming bump structure used for flip-chip mounting, the bump structure and the flip-chip 134 1995
6188127 Semiconductor packing stack module and method of producing the same 130 1996
6037665 Mounting assembly of integrated circuit device and method for production thereof 160 1998
 
SOCIONEXT INC. (1)
6159770 Method and apparatus for fabricating semiconductor device 149 1998
 
Dow Corning Corporation (1)
5611884 Flip chip silicone pressure sensitive conductive adhesive 138 1995
 
Topcat International Inc. (1)
6103992 Multiple frequency processing to minimize manufacturing variability of high aspect ratio micro through-vias 121 1996
 
FUJITSU SEMICONDUCTOR LIMITED (1)
6025650 Semiconductor device including a frame terminal 124 1997
 
TESSERA, INC. (5)
5682061 Component for connecting a semiconductor chip to a substrate 169 1995
6001671 Methods for manufacturing a semiconductor package having a sacrificial layer 488 1996
5861666 Stacked chip assembly 286 1996
5994222 Method of making chip mountings and assemblies 107 1997
6012224 Method of forming compliant microelectronic mounting device 125 1997
 
MICROELECTRONICS AND COMPUTER TECHNOLOGY CORPORATION (2)
5167992 Selective electroless plating process for metal conductors 91 1991
5116463 Detecting completion of electroless via fill 101 1991
 
NEC ELECTRONICS CORPORATION (3)
5060843 Process of forming bump on electrode of semiconductor chip and apparatus used therefor 91 1990
5294038 Method of and apparatus for manufacturing semiconductor device 71 1992
6218728 Mold-BGA-type semiconductor device and method for making the same 114 1998
 
AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD. (5)
5637920 High contact density ball grid array package for flip-chips 256 1995
5723369 Method of flip chip assembly 119 1996
5801072 Method of packaging integrated circuits 142 1996
5731223 Array of solder pads on an integrated circuit 91 1996
5973393 Apparatus and method for stackable molded lead frame ball grid array packaging of integrated circuits 112 1996
 
LAPIS SEMICONDUCTOR CO., LTD. (1)
5641113 Method for fabricating an electronic device having solder joints 154 1995
 
QUALCOMM INCORPORATED (1)
6103552 Wafer scale packaging scheme 232 1998
 
GENERAL ELECTRIC COMPANY (1)
4750666 Method of fabricating gold bumps on IC's and power chips 110 1986
 
SHARP KABUSHIKI KAISHA (1)
5447886 Method for mounting semiconductor chip on circuit board 129 1994
 
Sematech, Inc. (1)
5674787 Selective electroless copper deposited interconnect plugs for ULSI applications 484 1996
 
Draper Laboratory, Inc. (1)
5564181 Method of fabricating a laminated substrate assembly chips-first multichip module 96 1995
 
Nippondenso Co., Ltd. (1)
5656858 Semiconductor device with bump structure 189 1995
 
SHINKO ELECTRIC INDUSTRIES CO., LTD. (1)
5834844 Semiconductor device having an element with circuit pattern thereon 331 1996
 
ROHM CO., LTD. (1)
* 6897567 Method of making wireless semiconductor device, and leadframe used therefor 21 2001
 
AGILENT TECHNOLOGIES, INC. (1)
5854507 Multiple chip assembly 210 1998
 
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (10)
5014111 Electrical contact bump and a package provided with the same 119 1988
5090119 Method of forming an electrical contact bump 131 1990
5346750 Porous substrate and conductive ink filled vias for printed circuits 176 1993
5485949 Capillary for a wire bonding apparatus and a method for forming an electric connection bump using the capillary 102 1994
5484647 Connecting member of a circuit substrate and method of manufacturing multilayer circuit substrates by using the same 150 1994
5645628 Electroless plating bath used for forming a wiring of a semiconductor device, and method of forming a wiring of a semiconductor device 125 1995
5813115 Method of mounting a semiconductor chip on a wiring substrate 79 1995
5686353 Semiconductor device and manufacturing method thereof 96 1995
6088236 Semiconductor device having a bump having a rugged side 90 1997
6017812 Bump bonding method and bump bonding apparatus 71 1998
* Cited By Examiner

Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC (5)
* 8766408 Semiconductor device and manufacturing method thereof 0 2007
* 2007/0210,437 Semiconductor device and manufacturing method thereof 10 2007
8102039 Semiconductor device and manufacturing method thereof 10 2007
* 2010/0164,086 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF 29 2007
8686526 Semiconductor device and method of manufacturing the same 0 2007
 
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (14)
8492263 Protected solder ball joints in wafer level chip-scale packaging 7 2007
* 2009/0130,840 Protected Solder Ball Joints in Wafer Level Chip-Scale Packaging 42 2007
8299616 T-shaped post for semiconductor devices 7 2010
* 2011/0186,986 T-Shaped Post for Semiconductor Devices 23 2010
* 8318596 Pillar structure having a non-planar surface for semiconductor devices 5 2010
* 2011/0193,220 Pillar Structure having a Non-Planar Surface for Semiconductor Devices 23 2010
8241963 Recessed pillar structure 7 2010
7932601 Enhanced copper posts for wafer level chip scale packaging 6 2010
* 2011/0057,313 Enhanced Copper Posts for Wafer Level Chip Scale Packaging 6 2010
9230932 Interconnect crack arrestor structure and methods 0 2012
8546945 Pillar structure having a non-planar surface for semiconductor devices 6 2012
8803319 Pillar structure having a non-planar surface for semiconductor devices 1 2013
9136211 Protected solder ball joints in wafer level chip-scale packaging 0 2013
8921222 Pillar structure having a non-planar surface for semiconductor devices 0 2014
 
GLOBALFOUNDRIES INC. (1)
8492171 Techniques and structures for testing integrated circuits in flip-chip assemblies 0 2011
* Cited By Examiner

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