US Patent No: 7,129,575

Number of patents in Portfolio can not be more than 2000

Semiconductor chip assembly with bumped metal pillar

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Importance

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Abstract

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A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line, a bumped terminal and a metal pillar, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The routing line is contiguous with the bumped terminal and extends laterally beyond the bumped terminal and the metal pillar, and the metal pillar contacts and extends vertically beyond the bumped terminal.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
BRIDGE SEMICONDUCTOR CORPORATIONTAIPEI92

International Classification(s)

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  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chiang, Cheng-Lien Taipei, TW 55 902
Lin, Charles W C Singapore, SG 154 1688

Cited Art Landscape

Patent Info (Count) # Cites Year
 
TYCO INTERNATIONAL LTD., A CORPORATION OF BERMUDA (1)
4,955,523 Interconnection of electronic components 195 1988
 
SONY CORPORATION (1)
6,504,241 Stackable semiconductor device and method for manufacturing the same 64 1999
 
MULTEK FLEXIBLE CIRCUITS, INC. (2)
5,261,593 Direct application of unpackaged integrated circuit to flexible printed circuit 154 1992
5,615,477 Method for interconnecting a flip chip to a printed circuit substrate 181 1996
 
SAMSUNG ELECTRONICS CO., LTD. (4)
4,984,358 Method of assembling stacks of integrated circuit dies 168 1990
5,407,864 Process for mounting a semiconductor chip and depositing contacts into through holes of a circuit board and of an insulating interposer and onto the chip 124 1993
5,744,827 Three dimensional stack package device having exposed coupling lead portions and vertical interconnection elements 172 1996
6,608,371 Semiconductor device and method of manufacturing the same, circuit board, and electronic equipment 134 2001
 
HITACHI, LTD. (2)
5,595,943 Method for formation of conductor using electroless plating 100 1995
5,870,289 Chip connection structure having diret through-hole connections through adhesive film and wiring substrate 252 1995
 
EPOXY TECHNOLOGY, INC. (3)
5,074,947 Flip chip technology using electrically conductive polymers and dielectrics 213 1989
5,196,371 Flip chip bonding method using electrically conductive polymer bumps 193 1991
5,237,130 Flip chip technology using electrically conductive polymers and dielectrics 163 1991
 
AMKOR TECHNOLOGY, INC. (3)
5,478,007 Method for interconnection of integrated circuit chip and substrate 131 1994
6,281,568 Plastic integrated circuit device package and leadframe having partially undercut leads and die pad 321 1998
6,303,997 Thin, stackable semiconductor packages 321 1999
 
ELECTRO SCIENTIFIC INDUSTRIES, INC. (1)
5,614,114 Laser system and method for plating vias 141 1994
 
KABUSHIKI KAISHA TOSHIBA (9)
4,807,021 Semiconductor device having stacking structure 306 1987
4,970,571 Bump and method of manufacturing the same 135 1988
5,654,584 Semiconductor device having tape automated bonding leads 78 1994
5,556,814 Method of forming wirings for integrated circuits by electroplating 81 1995
5,556,810 Method for manufacturing a semiconductor device wherein a semiconductor chip is connected to a lead frame by metal plating 87 1995
5,536,973 Semiconductor device including a semiconductor element mounted on a substrate using bump-shaped connecting electrodes 95 1995
5,648,686 Connecting electrode portion in semiconductor device 98 1995
5,665,652 Method for manufacturing a semiconductor device wherein electrodes on a semiconductor chip are electrically connected to lead terminals by plating bonding 92 1996
5,801,447 Flip chip mounting type semiconductor device 92 1996
 
BELL TELEPHONE LABORATORIES INCORPORATED, 600 MOUNTAIN AVE., MURRAY HILL, NJ 07974-2070 A CORP. OF NY (2)
4,717,066 Method of bonding conductors to semiconductor devices 129 1986
4,937,653 Semiconductor integrated circuit chip-to-chip interconnection scheme 253 1988
 
Advanced Semiconductor Assembly Technology (1)
5,397,921 Tab grid array 327 1993
 
RAYTHEON COMPANY (1)
5,817,541 Methods of fabricating an HDMI decal chip scale package 130 1997
 
INVENSAS CORPORATION (2)
5,487,218 Method for making printed circuit boards with selectivity filled plated through holes 189 1994
5,611,140 Method of forming electrically conductive polymer interconnects on electrical substrates 148 1995
 
Ryoden Semiconductor System Engineering Corporation (1)
5,666,008 Flip chip semiconductor device 97 1996
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (11)
5,137,845 Method of forming metal contact pads and terminals on semiconductor chips 170 1991
5,209,817 Selective plating method for forming integral via and wiring layers 189 1991
5,483,421 IC chip attachment 174 1992
5,275,330 Solder ball connect pad-on-via assembly process 156 1993
5,542,601 Rework process for semiconductor chips mounted in a flip chip configuration on an organic substrate 106 1995
5,691,041 Socket for semi-permanently connecting a solder ball grid array device using a dendrite interposer 267 1995
5,822,856 Manufacturing circuit board assemblies having filled vias 165 1996
5,883,435 Personalization structure for semiconductor devices 201 1996
5,774,340 Planar redistribution structure and printed wiring device 184 1996
5,798,285 Method of making electronic module with multiple solder dams in soldermask window 111 1997
6,127,204 Column grid array or ball grid array pad on via 81 1998
 
PALOMAR TECHNOLOGIES, INC. (1)
5,364,004 Wedge bump bonding apparatus and method 81 1993
 
AT&T IPM CORP. (1)
5,477,933 Electronic device interconnection techniques 261 1994
 
LSI LOGIC CORPORATION (3)
5,438,477 Die-attach technique for flip-chip style mounting of semiconductor dies 159 1993
5,489,804 Flexible preformed planar structures for interposing between a chip and a substrate 189 1993
5,572,069 Conductive epoxy grid array semiconductor packages 79 1995
 
LUCENT TECHNOLOGIES INC. (2)
5,619,791 Method for fabricating highly conductive vias 91 1995
6,013,877 Solder bonding printed circuit boards 104 1998
 
U.S. PHILIPS CORPORATION (1)
4,442,967 Method of providing raised electrical contacts on electronic microcircuits 87 1982
 
NETWORK PROTECTION SCIENCES, LLC (1)
5,627,406 Inverted chip bonded module with high packaging efficiency 125 1996
 
Siliconix incorporated (1)
5,757,081 Surface mount and flip chip technology for total integrated circuit isolation 140 1996
 
VISTEON GLOBAL TECHNOLOGIES, INC. (1)
5,669,545 Ultrasonic flip chip bonding process and apparatus 104 1996
 
NATIONAL SCIENCE COUNCIL (1)
5,583,073 Method for producing electroless barrier layer and solder bump on chip 104 1995
 
FUJITSU LIMITED (5)
5,284,796 Process for flip chip connecting a semiconductor chip 170 1992
5,334,804 Wire interconnect structures for connecting an integrated circuit to a substrate 161 1992
5,454,161 Through hole interconnect substrate fabrication process 146 1993
5,475,236 Semiconductor chip for mounting on a semiconductor package substrate by a flip-clip process 147 1995
5,722,162 Fabrication procedure for a stable post 89 1995
 
HUGHES AIRCRAFT COMPANY (1)
5,525,065 Cavity and bump interconnection structure for electronic packages 92 1995
 
MOTOROLA, INC. (2)
4,661,192 Low cost integrated circuit bonding process 153 1985
5,576,052 Method of metallizing high aspect ratio apertures 117 1996
 
FLIPCHIP INTERNATIONAL (2)
5,547,740 Solderable contacts for flip chip integrated circuit devices 135 1995
5,803,340 Composite solder paste for flip chip bumping 99 1995
 
INTERSIL AMERICAS LLC (1)
5,646,067 Method of bonding wafers having vias including conductive material 267 1995
 
ROUND ROCK RESEARCH, LLC (5)
5,663,598 Electrical circuit bonding interconnect component and flip chip interconnect bond 86 1995
5,674,785 Method of producing a single piece package for semiconductor die 376 1995
5,739,585 Single piece package for semiconductor die 454 1996
5,811,879 Stacked leads-over-chip multi-chip module 197 1997
6,072,233 Stackable ball grid array package 327 1998
 
NATIONAL SEMICONDUCTOR CORPORATION (2)
5,508,229 Method for forming solder bumps in semiconductor devices 142 1994
5,627,405 Integrated circuit assembly incorporating an anisotropic elecctrically conductive layer 113 1995
 
INTEL CORPORATION (3)
5,757,071 C4 substrate contact pad which has a layer of Ni-B plating 81 1996
6,020,561 Printed circuit substrate with solder formed on pad-on-via and pad-off-via contacts thereof 111 1996
6,046,909 Computer card with a printed circuit board with vias providing strength to the printed circuit board 98 1998
 
F&K DELVOTEC BONDTECHNIK GMBH (1)
4,925,083 Ball bonding method and apparatus for performing the method 73 1988
 
MITSUBISHI DENKI KABUSHIKI KAISHA (1)
5,327,010 IC card having adhesion-preventing sheets 83 1990
 
TEXAS INSTRUMENTS INCORPORATED (2)
5,613,296 Method for concurrent formation of contact and via holes 90 1995
5,744,859 Semiconductor device 125 1996
 
Grumman Aerospace Corporation (2)
5,493,096 Thin substrate micro-via interconnect 133 1994
5,599,744 Method of forming a microcircuit via interconnect 109 1995
 
W. L. Gore & Associates, Inc. (1)
6,018,196 Semiconductor flip chip package 135 1999
 
DENSE-PAC MICROSYSTEMS, INC. (1)
6,180,881 Chip stack and method of making same 205 1998
 
CASIO COMPUTER CO., LTD. (1)
5,925,931 Semiconductor device having interconnect lines and connection electrodes formed in groove portions of an insulating layer 182 1997
 
MATSUSHITA ELECTRONICS CORPORATION (1)
5,172,851 Method of forming a bump electrode and manufacturing a resin-encapsulated semiconductor device 98 1991
 
SEIKO EPSON CORPORATION (1)
6,483,718 Semiconductor device and method of manufacture thereof, circuit board, and electronic instrument 61 2001
 
AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD. (6)
5,637,920 High contact density ball grid array package for flip-chips 253 1995
5,723,369 Method of flip chip assembly 119 1996
5,801,072 Method of packaging integrated circuits 142 1996
5,731,223 Array of solder pads on an integrated circuit 91 1996
5,764,486 Cost effective structure and method for interconnecting a flip chip with a substrate 108 1996
5,973,393 Apparatus and method for stackable molded lead frame ball grid array packaging of integrated circuits 102 1996
 
Micron Technology, Inc. (6)
5,789,271 Method for fabricating microbump interconnect for bare semiconductor dice 160 1996
5,808,360 Microbump interconnect for bore semiconductor dice 136 1996
5,736,456 Method of forming conductive bumps on die for flip chip applications 230 1996
5,804,771 Organic substrate (PCB) slip plane "stress deflector" for flip chip deivces 101 1996
6,084,781 Assembly aid for mounting packaged integrated circuit devices to printed circuit boards 128 1998
6,084,297 Cavity ball grid array apparatus 197 1998
 
FREESCALE SEMICONDUCTOR, INC. (3)
5,293,067 Integrated circuit chip carrier 122 1992
5,439,162 Direct chip attachment structure and method 128 1993
5,424,245 Method of forming vias through two-sided substrate 187 1994
 
VLSI TECHNOLOGY, INC. (1)
5,260,234 Method for bonding a lead to a die pad using an electroless plating solution 103 1991
 
COBHAM DEFENSE ELECTRONIC SYSTEMS CORPORATION (1)
5,454,928 Process for forming solid conductive vias in substrates 92 1994
 
TEIJIN LIMITED (1)
5,355,283 Ball grid array with via interconnection 380 1993
 
LG SEMICON CO., LTD. (1)
5,863,816 Fabrication method for chip size semiconductor package 79 1997
 
MASSACHUSETTS INSTITUTE OF TECHNOLOGY (1)
5,106,461 High-density, multi-level interconnects, flex circuits, and tape for tab 281 1990
 
NEC CORPORATION (4)
5,358,621 Method of manufacturing semiconductor devices 104 1992
5,633,204 Method and apparatus for forming bump structure used for flip-chip mounting, the bump structure and the flip-chip 133 1995
6,188,127 Semiconductor packing stack module and method of producing the same 124 1996
6,037,665 Mounting assembly of integrated circuit device and method for production thereof 158 1998
 
SOCIONEXT INC. (1)
6,159,770 Method and apparatus for fabricating semiconductor device 141 1998
 
DOW CORNING CORPORATION (1)
5,611,884 Flip chip silicone pressure sensitive conductive adhesive 131 1995
 
TOPCAT INTERNATIONAL, INC. (1)
6,103,992 Multiple frequency processing to minimize manufacturing variability of high aspect ratio micro through-vias 118 1996
 
FUJITSU SEMICONDUCTOR LIMITED (1)
6,025,650 Semiconductor device including a frame terminal 114 1997
 
TESSERA, INC. (5)
5,682,061 Component for connecting a semiconductor chip to a substrate 167 1995
6,001,671 Methods for manufacturing a semiconductor package having a sacrificial layer 467 1996
5,861,666 Stacked chip assembly 265 1996
5,994,222 Method of making chip mountings and assemblies 107 1997
6,012,224 Method of forming compliant microelectronic mounting device 123 1997
 
MICROELECTRONICS AND COMPUTER TECHNOLOGY CORPORATION (2)
5,167,992 Selective electroless plating process for metal conductors 91 1991
5,116,463 Detecting completion of electroless via fill 101 1991
 
NEC ELECTRONICS CORPORATION (3)
5,060,843 Process of forming bump on electrode of semiconductor chip and apparatus used therefor 91 1990
5,294,038 Method of and apparatus for manufacturing semiconductor device 71 1992
6,218,728 Mold-BGA-type semiconductor device and method for making the same 92 1998
 
LAPIS SEMICONDUCTOR CO., LTD. (1)
5,641,113 Method for fabricating an electronic device having solder joints 152 1995
 
QUALCOMM INCORPORATED (1)
6,103,552 Wafer scale packaging scheme 216 1998
 
GENERAL ELECTRIC COMPANY (1)
4,750,666 Method of fabricating gold bumps on IC's and power chips 109 1986
 
SHARP KABUSHIKI KAISHA (1)
5,447,886 Method for mounting semiconductor chip on circuit board 128 1994
 
SEMATECH, Inc. (1)
5,674,787 Selective electroless copper deposited interconnect plugs for ULSI applications 414 1996
 
Draper Laboratory, Inc. (1)
5,564,181 Method of fabricating a laminated substrate assembly chips-first multichip module 96 1995
 
NIPPONDENSO CO., LTD. (1)
5,656,858 Semiconductor device with bump structure 180 1995
 
SHINKO ELECTRIC INDUSTRIES CO., LTD. (1)
5,834,844 Semiconductor device having an element with circuit pattern thereon 326 1996
 
ROHM CO., LTD. (1)
* 6,897,567 Method of making wireless semiconductor device, and leadframe used therefor 21 2001
 
AGILENT TECHNOLOGIES, INC. (1)
5,854,507 Multiple chip assembly 188 1998
 
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (10)
5,014,111 Electrical contact bump and a package provided with the same 119 1988
5,090,119 Method of forming an electrical contact bump 129 1990
5,346,750 Porous substrate and conductive ink filled vias for printed circuits 176 1993
5,485,949 Capillary for a wire bonding apparatus and a method for forming an electric connection bump using the capillary 100 1994
5,484,647 Connecting member of a circuit substrate and method of manufacturing multilayer circuit substrates by using the same 149 1994
5,645,628 Electroless plating bath used for forming a wiring of a semiconductor device, and method of forming a wiring of a semiconductor device 107 1995
5,813,115 Method of mounting a semiconductor chip on a wiring substrate 79 1995
5,686,353 Semiconductor device and manufacturing method thereof 96 1995
6,088,236 Semiconductor device having a bump having a rugged side 89 1997
6,017,812 Bump bonding method and bump bonding apparatus 71 1998
* Cited By Examiner

Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (1)
8,492,171 Techniques and structures for testing integrated circuits in flip-chip assemblies 0 2011
 
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC (3)
* 8,766,408 Semiconductor device and manufacturing method thereof 0 2007
8,102,039 Semiconductor device and manufacturing method thereof 1 2007
8,686,526 Semiconductor device and method of manufacturing the same 0 2007
 
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (8)
8,492,263 Protected solder ball joints in wafer level chip-scale packaging 2 2007
8,299,616 T-shaped post for semiconductor devices 5 2010
* 8,318,596 Pillar structure having a non-planar surface for semiconductor devices 3 2010
8,241,963 Recessed pillar structure 3 2010
7,932,601 Enhanced copper posts for wafer level chip scale packaging 1 2010
8,546,945 Pillar structure having a non-planar surface for semiconductor devices 1 2012
8,803,319 Pillar structure having a non-planar surface for semiconductor devices 0 2013
8,921,222 Pillar structure having a non-planar surface for semiconductor devices 0 2014
* Cited By Examiner

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11.5 Year Payment $7400.00 $3700.00 $1850.00 Apr 30, 2018
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