US Patent No: 7,129,575

Number of patents in Portfolio can not be more than 2000

Semiconductor chip assembly with bumped metal pillar

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Importance

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Abstract

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A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line, a bumped terminal and a metal pillar, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The routing line is contiguous with the bumped terminal and extends laterally beyond the bumped terminal and the metal pillar, and the metal pillar contacts and extends vertically beyond the bumped terminal.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
BRIDGE SEMICONDUCTOR CORPORATIONTAIPEI127

International Classification(s)

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  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chiang, Cheng-Lien Taipei, TW 60 802
Lin, Charles W C Singapore, SG 149 1518

Cited Art Landscape

Patent Info (Count) # Cites Year
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (11)
5,137,845 Method of forming metal contact pads and terminals on semiconductor chips 166 1991
5,209,817 Selective plating method for forming integral via and wiring layers 188 1991
5,483,421 IC chip attachment 171 1992
5,275,330 Solder ball connect pad-on-via assembly process 146 1993
5,542,601 Rework process for semiconductor chips mounted in a flip chip configuration on an organic substrate 106 1995
5,691,041 Socket for semi-permanently connecting a solder ball grid array device using a dendrite interposer 246 1995
5,822,856 Manufacturing circuit board assemblies having filled vias 165 1996
5,883,435 Personalization structure for semiconductor devices 197 1996
5,774,340 Planar redistribution structure and printed wiring device 175 1996
5,798,285 Method of making electronic module with multiple solder dams in soldermask window 109 1997
6,127,204 Column grid array or ball grid array pad on via 80 1998
 
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (10)
5,014,111 Electrical contact bump and a package provided with the same 117 1988
5,090,119 Method of forming an electrical contact bump 129 1990
5,346,750 Porous substrate and conductive ink filled vias for printed circuits 176 1993
5,485,949 Capillary for a wire bonding apparatus and a method for forming an electric connection bump using the capillary 100 1994
5,484,647 Connecting member of a circuit substrate and method of manufacturing multilayer circuit substrates by using the same 149 1994
5,645,628 Electroless plating bath used for forming a wiring of a semiconductor device, and method of forming a wiring of a semiconductor device 96 1995
5,813,115 Method of mounting a semiconductor chip on a wiring substrate 79 1995
5,686,353 Semiconductor device and manufacturing method thereof 94 1995
6,088,236 Semiconductor device having a bump having a rugged side 88 1997
6,017,812 Bump bonding method and bump bonding apparatus 71 1998
 
KABUSHIKI KAISHA TOSHIBA (9)
4,807,021 Semiconductor device having stacking structure 293 1987
4,970,571 Bump and method of manufacturing the same 133 1988
5,654,584 Semiconductor device having tape automated bonding leads 78 1994
5,556,814 Method of forming wirings for integrated circuits by electroplating 81 1995
5,556,810 Method for manufacturing a semiconductor device wherein a semiconductor chip is connected to a lead frame by metal plating 87 1995
5,536,973 Semiconductor device including a semiconductor element mounted on a substrate using bump-shaped connecting electrodes 95 1995
5,648,686 Connecting electrode portion in semiconductor device 97 1995
5,665,652 Method for manufacturing a semiconductor device wherein electrodes on a semiconductor chip are electrically connected to lead terminals by plating bonding 92 1996
5,801,447 Flip chip mounting type semiconductor device 92 1996
 
LSI LOGIC CORPORATION (8)
5,438,477 Die-attach technique for flip-chip style mounting of semiconductor dies 159 1993
5,489,804 Flexible preformed planar structures for interposing between a chip and a substrate 187 1993
5,572,069 Conductive epoxy grid array semiconductor packages 79 1995
5,637,920 High contact density ball grid array package for flip-chips 251 1995
5,723,369 Method of flip chip assembly 118 1996
5,801,072 Method of packaging integrated circuits 142 1996
5,731,223 Array of solder pads on an integrated circuit 90 1996
5,973,393 Apparatus and method for stackable molded lead frame ball grid array packaging of integrated circuits 101 1996
 
MICRON TECHNOLOGY, INC. (6)
5,789,271 Method for fabricating microbump interconnect for bare semiconductor dice 160 1996
5,808,360 Microbump interconnect for bore semiconductor dice 134 1996
5,736,456 Method of forming conductive bumps on die for flip chip applications 224 1996
5,804,771 Organic substrate (PCB) slip plane "stress deflector" for flip chip deivces 101 1996
6,084,781 Assembly aid for mounting packaged integrated circuit devices to printed circuit boards 128 1998
6,084,297 Cavity ball grid array apparatus 197 1998
 
FUJITSU LIMITED (5)
5,284,796 Process for flip chip connecting a semiconductor chip 166 1992
5,334,804 Wire interconnect structures for connecting an integrated circuit to a substrate 157 1992
5,454,161 Through hole interconnect substrate fabrication process 128 1993
5,475,236 Semiconductor chip for mounting on a semiconductor package substrate by a flip-clip process 147 1995
5,722,162 Fabrication procedure for a stable post 89 1995
 
ROUND ROCK RESEARCH, LLC (5)
5,663,598 Electrical circuit bonding interconnect component and flip chip interconnect bond 86 1995
5,674,785 Method of producing a single piece package for semiconductor die 365 1995
5,739,585 Single piece package for semiconductor die 440 1996
5,811,879 Stacked leads-over-chip multi-chip module 196 1997
6,072,233 Stackable ball grid array package 318 1998
 
TESSERA, INC. (5)
5,682,061 Component for connecting a semiconductor chip to a substrate 165 1995
6,001,671 Methods for manufacturing a semiconductor package having a sacrificial layer 443 1996
5,861,666 Stacked chip assembly 251 1996
5,994,222 Method of making chip mountings and assemblies 107 1997
6,012,224 Method of forming compliant microelectronic mounting device 121 1997
 
NEC CORPORATION (4)
5,358,621 Method of manufacturing semiconductor devices 91 1992
5,633,204 Method and apparatus for forming bump structure used for flip-chip mounting, the bump structure and the flip-chip 132 1995
6,188,127 Semiconductor packing stack module and method of producing the same 118 1996
6,037,665 Mounting assembly of integrated circuit device and method for production thereof 158 1998
 
SAMSUNG ELECTRONICS CO., LTD. (4)
4,984,358 Method of assembling stacks of integrated circuit dies 167 1990
5,407,864 Process for mounting a semiconductor chip and depositing contacts into through holes of a circuit board and of an insulating interposer and onto the chip 122 1993
5,744,827 Three dimensional stack package device having exposed coupling lead portions and vertical interconnection elements 172 1996
6,608,371 Semiconductor device and method of manufacturing the same, circuit board, and electronic equipment 123 2001
 
AMKOR TECHNOLOGY, INC. (3)
5,478,007 Method for interconnection of integrated circuit chip and substrate 131 1994
6,281,568 Plastic integrated circuit device package and leadframe having partially undercut leads and die pad 309 1998
6,303,997 Thin, stackable semiconductor packages 297 1999
 
EPOXY TECHNOLOGY, INC. (3)
5,074,947 Flip chip technology using electrically conductive polymers and dielectrics 212 1989
5,196,371 Flip chip bonding method using electrically conductive polymer bumps 192 1991
5,237,130 Flip chip technology using electrically conductive polymers and dielectrics 163 1991
 
FREESCALE SEMICONDUCTOR, INC. (3)
5,293,067 Integrated circuit chip carrier 122 1992
5,439,162 Direct chip attachment structure and method 126 1993
5,424,245 Method of forming vias through two-sided substrate 181 1994
 
INTEL CORPORATION (3)
5,757,071 C4 substrate contact pad which has a layer of Ni-B plating 81 1996
6,020,561 Printed circuit substrate with solder formed on pad-on-via and pad-off-via contacts thereof 111 1996
6,046,909 Computer card with a printed circuit board with vias providing strength to the printed circuit board 98 1998
 
NEC ELECTRONICS CORPORATION (3)
5,060,843 Process of forming bump on electrode of semiconductor chip and apparatus used therefor 91 1990
5,294,038 Method of and apparatus for manufacturing semiconductor device 71 1992
6,218,728 Mold-BGA-type semiconductor device and method for making the same 72 1998
 
Bell Telephone Laboratories, Incorporated (2)
4,717,066 Method of bonding conductors to semiconductor devices 129 1986
4,937,653 Semiconductor integrated circuit chip-to-chip interconnection scheme 247 1988
 
FLIPCHIP INTERNATIONAL (2)
5,547,740 Solderable contacts for flip chip integrated circuit devices 135 1995
5,803,340 Composite solder paste for flip chip bumping 99 1995
 
FUJITSU SEMICONDUCTOR LIMITED (2)
6,025,650 Semiconductor device including a frame terminal 112 1997
6,159,770 Method and apparatus for fabricating semiconductor device 135 1998
 
Grumman Aerospace Corporation (2)
5,493,096 Thin substrate micro-via interconnect 129 1994
5,599,744 Method of forming a microcircuit via interconnect 109 1995
 
HITACHI, LTD. (2)
5,595,943 Method for formation of conductor using electroless plating 100 1995
5,870,289 Chip connection structure having diret through-hole connections through adhesive film and wiring substrate 248 1995
 
INVENSAS CORPORATION (2)
5,487,218 Method for making printed circuit boards with selectivity filled plated through holes 184 1994
5,611,140 Method of forming electrically conductive polymer interconnects on electrical substrates 147 1995
 
LUCENT TECHNOLOGIES INC. (2)
5,619,791 Method for fabricating highly conductive vias 90 1995
6,013,877 Solder bonding printed circuit boards 104 1998
 
MICROELECTRONICS AND COMPUTER TECHNOLOGY CORPORATION (2)
5,167,992 Selective electroless plating process for metal conductors 90 1991
5,116,463 Detecting completion of electroless via fill 100 1991
 
MOTOROLA, INC. (2)
4,661,192 Low cost integrated circuit bonding process 153 1985
5,576,052 Method of metallizing high aspect ratio apertures 115 1996
 
MULTEK FLEXIBLE CIRCUITS, INC. (2)
5,261,593 Direct application of unpackaged integrated circuit to flexible printed circuit 153 1992
5,615,477 Method for interconnecting a flip chip to a printed circuit substrate 171 1996
 
NATIONAL SEMICONDUCTOR CORPORATION (2)
5,508,229 Method for forming solder bumps in semiconductor devices 141 1994
5,627,405 Integrated circuit assembly incorporating an anisotropic elecctrically conductive layer 112 1995
 
TEXAS INSTRUMENTS INCORPORATED (2)
5,613,296 Method for concurrent formation of contact and via holes 90 1995
5,744,859 Semiconductor device 125 1996
 
Advanced Semiconductor Assembly Technology (1)
5,397,921 Tab grid array 320 1993
 
AGILENT TECHNOLOGIES, INC. (1)
5,854,507 Multiple chip assembly 166 1998
 
AT&T IPM CORP. (1)
5,477,933 Electronic device interconnection techniques 247 1994
 
AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD. (1)
5,764,486 Cost effective structure and method for interconnecting a flip chip with a substrate 106 1996
 
CASIO COMPUTER CO., LTD. (1)
5,925,931 Semiconductor device having interconnect lines and connection electrodes formed in groove portions of an insulating layer 169 1997
 
COBHAM DEFENSE ELECTRONIC SYSTEMS CORPORATION (1)
5,454,928 Process for forming solid conductive vias in substrates 92 1994
 
DENSE-PAC MICROSYSTEMS, INC. (1)
6,180,881 Chip stack and method of making same 203 1998
 
DOW CORNING CORPORATION (1)
5,611,884 Flip chip silicone pressure sensitive conductive adhesive 129 1995
 
Draper Laboratory, Inc. (1)
5,564,181 Method of fabricating a laminated substrate assembly chips-first multichip module 96 1995
 
ELECTRO SCIENTIFIC INDUSTRIES, INC. (1)
5,614,114 Laser system and method for plating vias 141 1994
 
F&K DELVOTEC BONDTECHNIK GMBH (1)
4,925,083 Ball bonding method and apparatus for performing the method 73 1988
 
GENERAL ELECTRIC COMPANY (1)
4,750,666 Method of fabricating gold bumps on IC's and power chips 109 1986
 
Hughes Aircraft Company (1)
5,525,065 Cavity and bump interconnection structure for electronic packages 92 1995
 
INTERSIL AMERICAS LLC (1)
5,646,067 Method of bonding wafers having vias including conductive material 261 1995
 
LAPIS SEMICONDUCTOR CO., LTD. (1)
5,641,113 Method for fabricating an electronic device having solder joints 150 1995
 
LG SEMICON CO., LTD. (1)
5,863,816 Fabrication method for chip size semiconductor package 79 1997
 
MASSACHUSETTS INSTITUTE OF TECHNOLOGY (1)
5,106,461 High-density, multi-level interconnects, flex circuits, and tape for tab 279 1990
 
MATSUSHITA ELECTRONICS CORPORATION (1)
5,172,851 Method of forming a bump electrode and manufacturing a resin-encapsulated semiconductor device 98 1991
 
MITSUBISHI DENKI KABUSHIKI KAISHA (1)
5,327,010 IC card having adhesion-preventing sheets 83 1990
 
NATIONAL SCIENCE COUNCIL (1)
5,583,073 Method for producing electroless barrier layer and solder bump on chip 104 1995
 
NETWORK PROTECTION SCIENCES, LLC (1)
5,627,406 Inverted chip bonded module with high packaging efficiency 123 1996
 
Nippondenso Co., Ltd. (1)
5,656,858 Semiconductor device with bump structure 176 1995
 
PALOMAR TECHNOLOGIES, INC. (1)
5,364,004 Wedge bump bonding apparatus and method 74 1993
 
QUALCOMM INCORPORATED (1)
6,103,552 Wafer scale packaging scheme 209 1998
 
RAYTHEON COMPANY (1)
5,817,541 Methods of fabricating an HDMI decal chip scale package 129 1997
 
ROHM CO., LTD. (1)
6,897,567 Method of making wireless semiconductor device, and leadframe used therefor 21 2001
 
RYODEN SEMICONDUCTOR SYSTEM ENGINEERING CORPORATION (1)
5,666,008 Flip chip semiconductor device 97 1996
 
SEIKO EPSON CORPORATION (1)
6,483,718 Semiconductor device and method of manufacture thereof, circuit board, and electronic instrument 61 2001
 
SEMATECH, INC. (1)
5,674,787 Selective electroless copper deposited interconnect plugs for ULSI applications 391 1996
 
SHARP KABUSHIKI KAISHA (1)
5,447,886 Method for mounting semiconductor chip on circuit board 127 1994
 
SHINKO ELECTRIC INDUSTRIES CO., LTD. (1)
5,834,844 Semiconductor device having an element with circuit pattern thereon 321 1996
 
Siliconix incorporated (1)
5,757,081 Surface mount and flip chip technology for total integrated circuit isolation 131 1996
 
SONY CORPORATION (1)
6,504,241 Stackable semiconductor device and method for manufacturing the same 64 1999
 
TEIJIN LIMITED (1)
5,355,283 Ball grid array with via interconnection 368 1993
 
Topcat International Inc. (1)
6,103,992 Multiple frequency processing to minimize manufacturing variability of high aspect ratio micro through-vias 117 1996
 
TYCO INTERNATIONAL LTD., A CORPORATION OF BERMUDA (1)
4,955,523 Interconnection of electronic components 194 1988
 
U.S. Philips Corporation (1)
4,442,967 Method of providing raised electrical contacts on electronic microcircuits 87 1982
 
VISTEON GLOBAL TECHNOLOGIES, INC. (1)
5,669,545 Ultrasonic flip chip bonding process and apparatus 104 1996
 
VLSI TECHNOLOGY, INC. (1)
5,260,234 Method for bonding a lead to a die pad using an electroless plating solution 103 1991
 
W. L. GORE & ASSOCIATES, INC. (1)
6,018,196 Semiconductor flip chip package 127 1999

Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (7)
8,492,263 Protected solder ball joints in wafer level chip-scale packaging 0 2007
8,299,616 T-shaped post for semiconductor devices 3 2010
8,318,596 Pillar structure having a non-planar surface for semiconductor devices 2 2010
8,241,963 Recessed pillar structure 1 2010
7,932,601 Enhanced copper posts for wafer level chip scale packaging 0 2010
8,546,945 Pillar structure having a non-planar surface for semiconductor devices 0 2012
8,803,319 Pillar structure having a non-planar surface for semiconductor devices 0 2013
 
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC (3)
8,766,408 Semiconductor device and manufacturing method thereof 0 2007
8,102,039 Semiconductor device and manufacturing method thereof 1 2007
8,686,526 Semiconductor device and method of manufacturing the same 0 2007
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (1)
8,492,171 Techniques and structures for testing integrated circuits in flip-chip assemblies 0 2011

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