Structure and method of making capped chips including vertical interconnects having stud bumps engaged to surfaces of said caps
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United States of America Patent
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Oct 31, 2006
Issued Date -
N/A
app pub date -
Sep 24, 2004
filing date -
Sep 26, 2003
priority date (Note) -
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status (Latency Note)
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Abstract
A capped chip is provided which includes a chip and a cap member, the chip having a front surface and a plurality of bond pads exposed at the front surface, the cap member having a bottom surface facing the front surface of the chip and having a top surface opposite the front surface. A plurality of through holes extend from the bottom surface of the cap member to the top surface. The capped chip assembly further includes a plurality of metallic interconnects extending from the bond pads at least partially through the through holes, the metallic interconnects including stud bumps joined to the bond pads, the stud bumps contacting and engaging at least one of (i) the top surface of the cap member surrounding the through holes and (ii) inner surfaces of the through holes.
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