Helical microelectronic contact and method for fabricating same
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United States of America Patent
Stats
-
Nov 7, 2006
Issued Date -
N/A
app pub date -
Sep 27, 2005
filing date -
Apr 10, 2003
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A microelectronic spring contact for making electrical contact between a device and a mating substrate and method of making the same are disclosed. The spring contact has a compliant pad adhered to a substrate of the device and spaced apart from a terminal of the device. The compliant pad has a base adhered to the substrate, and side surfaces extending away from the substrate and tapering to a smaller end area distal from the substrate. A trace extends from the terminal of the device in a coil pattern over the compliant pad to its end area, forming a helix. At least a portion of the compliant pad end area is covered by the trace, and a portion of the trace that is over the compliant pad is supported by the compliant pad. In an alternative embodiment, the pad is removed to leave a freestanding helical contact.
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