Devices having compliant wafer-level packages with pillars and methods of fabrication
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Nov 7, 2006
Grant Date -
Jul 3, 2003
app pub date -
Oct 31, 2002
filing date -
Oct 31, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Devices and methods of fabrication thereof are disclosed. A representative device includes a complaint wafer-level package having one or more lead packages. A representative lead package includes a substrate having a plurality of die pads disposed thereon and a plurality of leads attached to the plurality of die pads. In addition, the lead package includes a plurality of pillars made of a low modulus material. Each pillar is disposed between the substrate and at least one lead, and each lead is disposed upon one of the pillars that compliantly support the lead.
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