Cutting segment, method of manufacturing cutting segment, and cutting tool

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 7134430
APP PUB NO 20050235978A1
SERIAL NO

11010195

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Abstract

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A cutting segment for a cutting tool used for cutting or drilling a brittle workpiece, such as stone, brick, concrete and asphalt, a method of manufacturing the segment and a cutting tool provided with the segment are disclosed. The segment comprises a plurality of plate-shaped metal matrix layers laminated perpendicular to a cutting surface of the segment while being parallel to a cutting direction of the segment, the plate-shaped metal matrix layers being integrally combined with each other and made of a ferrous or non-ferrous material; and diamond particle layers arranged between the plate-shaped metal matrix layers such that diamond particles can be provided in an array on the cutting surface. The segment has an excellent cutting capability, and can be made by a simplified manufacturing process, thereby remarkably reducing manufacturing costs.

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Patent Owner(s)

Patent OwnerAddress
EHWA DIAMOND INDUSTRIAL CO LTDKYUNGGIDO 447804

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kim, Soo-Kwang Irvine, CA 12 68
Park, Hee-Dong Kyungki-do, KR 20 96

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