Devices having compliant wafer-level input/output interconnections and packages using pillars and methods of fabrication thereof
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Nov 14, 2006
Grant Date -
Nov 6, 2003
app pub date -
May 5, 2003
filing date -
May 3, 2002
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Devices having one or more of the following: an input/output (I/O) interconnect system, an optical I/O interconnect, an electrical I/O interconnect, a radio frequency I/O interconnect, are disclosed. A representative I/O interconnect system includes a first substrate and a second substrate. The first substrate includes a compliant pillar vertically extending from the first substrate. The compliant pillar is constructed a first material. The second substrate includes a compliant socket adapted to receive the compliant pillar. The compliant socket is constructed of a second material.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully