Programmed material consolidation methods for fabricating printed circuit board
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United States of America Patent
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Nov 21, 2006
Issued Date -
N/A
app pub date -
Jul 20, 2004
filing date -
Feb 24, 2000
priority date (Note) -
Expired
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Abstract
Methods for fabricating semiconductor device components include use of programmed material consolidation processes to form the substrates or conductive elements thereof. The features that are formed by such processes may include multiple adjacent, mutually adhered regions. A machine vision system may be used so that the programmed material consolidation system may recognize the position, orientation, and features of a semiconductor device assembly, semiconductor die, or other substrate on which an element is to be fabricated.
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