US Patent No: 7,138,068

Number of patents in Portfolio can not be more than 2000

Printed circuit patterned embedded capacitance layer

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ALSO PUBLISHED AS: 20060207970
ATTORNEY / AGENT: (SPONSORED)
 

Importance

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Abstract

A method is disclosed for fabricating a patterned embedded capacitance layer. The method includes fabricating (1305, 1310) a ceramic oxide layer (510) overlying a conductive metal layer (515) overlying a printed circuit substrate (505), perforating (1320) the ceramic oxide layer within a region (705), and removing (1325) the ceramic oxide layer and the conductive metal layer in the region by chemical etching of the conductive metal layer. The ceramic oxide layer may be less than 1 micron thick.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
MOTOROLA SOLUTIONS, INC.SCHAUMBURG, IL2264

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Croswell, Robert T Hanover Park, IL 17 40
Dunn, Gregory J Arlington Heights, IL 66 426
Magera, Jaroslaw A Palatine, IL 9 18
Savic, Jovica Downers Grove, IL 28 143
Tungare, Aroon V Winfield, IL 22 55

Cited Art

Patent Info (Count) # Cites Year
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (2)
5,027,253 Printed circuit boards and cards having buried thin film capacitors and processing techniques for fabricating said boards and cards 106 1990
5,796,587 Printed circut board with embedded decoupling capacitance and method for producing same 50 1996
 
MITSUI MINING & SMELTING CO., LTD. (2)
6,183,880 Composite foil of aluminum and copper 14 1998
6,660,406 Method for manufacturing printed wiring board comprising electrodeposited copper foil with carrier and resistor circuit; and printed wiring board comprising resistor circuit 7 2001
 
3M INNOVATIVE PROPERTIES COMPANY (1)
2004/0256,731 Dielectric composite material 16 2003
 
CTC CORPORATION (1)
6,005,777 Ball grid array capacitor 21 1998
 
INTEL CORPORATION (1)
6,407,929 Electronic package having embedded capacitors and method of fabrication therefor 83 2000
 
NORTH CAROLINA STATE UNIVERSITY (1)
6,541,137 Multi-layer conductor-dielectric oxide structure 47 2000
 
U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL TRUSTEE (1)
5,261,153 In situ method for forming a capacitive PCB 164 1992
 
WELLS FARGO BANK, NATIONAL ASSOCIATION (1)
6,346,335 Copper foil composite including a release layer 36 2000

Patent Citation Ranking

Forward Cites

Patent Info (Count) # Cites Year
 
KEMET ELECTRONICS CORPORATION (1)
8,410,536 Substrate with embedded patterned capacitance 0 2012

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