Semiconductor package including leads and conductive posts for providing increased functionality
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United States of America Patent
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Nov 21, 2006
Issued Date -
N/A
app pub date -
Oct 21, 2003
filing date -
Oct 21, 2003
priority date (Note) -
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Abstract
A semiconductor package comprising a semiconductor die which has opposed first and second surfaces and at least first and second bond pads disposed on the second surface thereof. In addition to the semiconductor die, the semiconductor package includes at least one lead having opposed first and second surfaces, the first surface of the lead being electrically connected to the first bond pad. Also included in the semiconductor package is at least one conductive post having opposed first and second surfaces, the first surface of the conductive post being electrically connected to the second bond pad. A package body at least partially encapsulates the semiconductor die, the lead, and the conductive post such that the second surface of the lead and the second surface of the conductive post are exposed in a common exterior surface of the package body.
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