Semiconductor device manufacturing apparatus and semiconductor device manufacturing method for forming semiconductor chips by dividing semiconductor wafer
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United States of America Patent
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Nov 28, 2006
Grant Date -
Jul 15, 2004
app pub date -
Mar 12, 2003
filing date -
Jan 10, 2003
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An apparatus for manufacturing a semiconductor device includes a first affixing mechanism, cutting mechanism, a second affixing mechanism and peeling mechanism. The first affixing mechanism affixes a first holding member to a rear surface of a semiconductor wafer which is opposite to an element forming surface thereof. The cutting mechanism cuts and discretely divides the semiconductor wafer. The second affixing mechanism affixes a second holding member to the element forming surface side of the semiconductor wafer while the first holding member is expanded to widen gaps of semiconductor elements of the discretely divided semiconductor wafer. The peeling mechanism peels the first holding member.
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