Semiconductor package
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Nov 28, 2006
Grant Date -
Nov 25, 2004
app pub date -
Mar 12, 2004
filing date -
May 19, 2003
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A semiconductor package 11 which has a plurality of connection terminals 14 to be connected to a board and a plurality of test terminals 15, which usually do not need to be connected to the board and are for performance test by the maker, on a joint surface 12 thereof to the board. Placed in the semiconductor package are a predetermined-pitch area 16 where the connection terminals 14 are arranged at predetermined pitches in a lattice and a narrow-pitch area 17 where the test terminals 15 are arranged at pitches narrower than the predetermined pitches in a lattice.
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