Semiconductor manufacturing device and semiconductor manufacturing method
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United States of America Patent
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Nov 28, 2006
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app pub date -
Nov 23, 2004
filing date -
Dec 3, 2003
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Abstract
A semiconductor manufacturing device includes a prober whose needles are at once engaged for contacting pads of two chip forming regions within a wafer. In one chip forming region, trimming is performed, while in the other chip forming region, inspecting posterior to trimming is performed.
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