Manufacturing method for leadframe and for semiconductor package using the leadframe
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United States of America Patent
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Dec 5, 2006
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N/A
app pub date -
Nov 7, 2003
filing date -
Nov 7, 2003
priority date (Note) -
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Abstract
In accordance with the present invention, there is provided a method for manufacturing a leadframe. The method comprises the initial step of bonding a primary leadframe to an adhesive tape layer, the primary leadframe including a die paddle and a plurality of leads which extend at least partially about the die paddle in spaced relation thereto. Thereafter, a photo resist is applied to the primary leadframe and to the adhesive tape layer. The photo resist is then patterned to define at least one exposed area in each of the leads of the primary leadframe. The exposed areas of the leads are then etched to divide the leads into an inner set which extends at least partially about the die paddle and an outer set which extends at least partially about the inner set. Thereafter, the photo resist is removed from the die paddle and from the inner and outer sets of the leads.
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