Device having resin package and method of producing the same
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United States of America Patent
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Dec 5, 2006
Issued Date -
N/A
app pub date -
Jun 1, 2004
filing date -
Nov 8, 1995
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A device including a chip, and a resin package sealing the chip, the resin package having resin projections located on a mount-side surface of the resin package. Metallic films are respectively provided to the resin projections. Connecting parts electrically connect electrode pads of the chip and the metallic film.
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