Packaging platform having an adjustable thickness
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United States of America Patent
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Dec 12, 2006
Issued Date -
N/A
app pub date -
Mar 11, 2003
filing date -
Mar 11, 2003
priority date (Note) -
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status (Latency Note)
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Abstract
A platform (40) has a rigid body with an adjustable thickness (t) to selectively occupy any remaining space within a container (20) used for packaging items such as semiconductor wafers (22). The platform (40) in one example has a first portion (42) and a second portion (44). Adjusting the positions of the first and second portions (42, 44) relative to each other selectively varies the thickness (t) of the platform (40) to achieve the desired thickness.
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