Method for annealing an electrodeposition structure

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United States of America Patent

PATENT NO 7147201
SERIAL NO

10952649

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Abstract

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A method for annealing a structure formed by electrodeposition is provided, the method comprising providing the electrodeposition structure, the electrodeposition structure comprising an electroformed mold, the electroformed mold having a nominal thickness between and including 0.5 mm to 8.0 mm and having a melting temperature; heating the electrodeposition structure to a temperature between ambient temperature and the melting temperature of the electrodeposition structure; isostatically pressurizing the electrodeposition structure to a pressure above ambient pressure; cooling the electrodeposition structure to ambient temperature; and depressurizing the electrodeposition structure to ambient pressure.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
COLLINS & AIKMAN CORPORATIONNEW YORK, NY0

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Combs, Richard Farmington, NH 7 120
Grimmer, Robert Berwick, ME 4 2
Risca, Alex Troy, MI 3 10

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