Thickness control method and double side polisher
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United States of America Patent
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Dec 12, 2006
Grant Date -
Aug 31, 2006
app pub date -
Feb 23, 2006
filing date -
Feb 25, 2005
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The object of the present invention is to provide a double side polisher capable of maintaining thickness control accuracy over a long period of time without being affected by a gradual change in thickness of a polishing pad, and a thickness control method. The first polishing operation is finished based on the polishing duration time, and the second and subsequent polishing operations are finished based on the measured distance values of a distance sensor, and after each polishing operation including the first polishing, the measured value of the distance sensor is calibrated based on the measured value and target value of finishing thickness of the work piece. Since the calibration is performed for each polishing operation, it is possible to maintain thickness control accuracy over a long period of time.
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