Method of making a semiconductor chip assembly with a press-fit ground plane
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Dec 12, 2006
Issued Date -
N/A
app pub date -
Jun 17, 2004
filing date -
Jun 11, 2004
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method of making a semiconductor chip assembly includes providing a semiconductor chip that includes a conductive pad, then electrically connecting a conductive trace that includes a pillar and a routing line to the pad, and then press-fitting the pillar into an opening in a ground plane, thereby electrically connecting the ground plane and the pad.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully