Electronic component mounting structure onto board
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Dec 12, 2006
Grant Date -
Sep 22, 2005
app pub date -
Jan 18, 2005
filing date -
Jan 19, 2004
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A rotary electronic component is secured to a board by snap-in engagement of engagement portions provided on mounting portions of the electronic component with respective board engagement portions provided on the board. Terminal plates projecting from a side of the electronic component are bent toward the board. The distal end portions of the bent terminal plates are retained by a terminal plate retainer projecting from the side of the electronic component. The retained distal end portions of the terminal plates are connected to respective terminal plate connecting portions provided on the board.
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