Thiourea- and cyanide-free bath and process for electrolytic etching of gold
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United States of America Patent
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Dec 19, 2006
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app pub date -
Sep 22, 2003
filing date -
Sep 22, 2003
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Abstract
An aqueous thiourea-free gold etching bath for electrolytically etching gold from a microelectronic workpiece. One embodiment of the aqueous thiourea-free bath contains: (a) about 0.5 1.5 M iodide; (b) about 0.1 0.3 M sulfite; and (c) about 1.0 3.0 g/L wetting agent. The bath is useful in a process for electrolytically etching gold from a microelectronic workpiece. A tool system in which the baths and processes of the present invention may be used is also described.
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