Apparatus and method for depositing and planarizing thin films of semiconductor wafers
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United States of America Patent
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Dec 26, 2006
Issued Date -
N/A
app pub date -
Jun 27, 2003
filing date -
Sep 30, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An electroplating apparatus for depositing a metallic layer on a surface of a wafer is provided. In one example, a proximity head capable of being electrically charged as an anode is placed in close proximity to the surface of the wafer. A plating fluid is provided between the wafer and the proximity head to create localized metallic plating.
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