Encapsulation of MEMS devices using pillar-supported caps
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United States of America Patent
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Dec 26, 2006
Grant Date -
Aug 14, 2003
app pub date -
Dec 13, 2002
filing date -
May 30, 2000
priority date (Note) -
In Force
status (Latency Note)
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Abstract
This invention comprises a process for fabricating a MEMS microstructure in a sealed cavity wherein the etchant entry holes are created as a by-product of the fabrication process without an additional step to etch holes in the cap layer. The process involves extending the layers of sacrificial material past the horizontal boundaries of the cap layer. The cap layer is supported by pillars formed by a deposition in holes etched through the sacrificial layers, and the etchant entry holes are formed when the excess sacrificial material is etched away, leaving voids between the pillars supporting the cap.
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