Method of fabricating no-lead package for semiconductor die with half-etched leadframe
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United States of America Patent
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Dec 26, 2006
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N/A
app pub date -
Aug 8, 2003
filing date -
Aug 8, 2003
priority date (Note) -
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Abstract
A series of grooves are etched in a leadframe to be used in fabricating a group of semiconductor packages at locations where the leadframe will later be sawed to separate the semiconductor packages. In variations of the process, the grooves may be wider or narrower than the kerf of the saw cuts and may be formed on the side of the leadframe facing towards or away from the entry of the saw blade.
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