Methods of forming silicide films in semiconductor devices

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 7153772
SERIAL NO

10866643

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Abstract

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A method of self-aligned silicidation involves interruption of the silicidation process prior to complete reaction of the blanket material (e.g., metal) in regions directly overlying patterned and exposed other material (e.g., silicon). Diffusion of excess blanket material from over other regions (e.g., overlying insulators) is thus prevented. Control and uniformity are insured by use of conductive rapid thermal annealing in hot wall reactors, with massive heated plates closely spaced from the substrate surfaces. Interruption is particularly facilitated by forced cooling, preferably also by conductive thermal exchange with closely spaced, massive plates.

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Patent Owner(s)

Patent OwnerAddress
ASM INTERNATIONAL N VVERSTERKERSTRAAT 8 ALMERE 1322 AP

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Granneman, Ernst H A Hilversum, NL 26 2611
Kuznetsov, Vladimir Ultrecht, NL 89 920
Pages, Xavier Lovenjoel, BE 5 116
van, der Jeugd Cornelius A Heverlee, BE 25 2566

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