Mounting structure for integrated circuit
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United States of America Patent
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Dec 26, 2006
Grant Date -
Dec 8, 2005
app pub date -
Nov 29, 2004
filing date -
Jun 3, 2004
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
In a mounting structure of an integrated circuit, an electrolytic capacitor for smoothing power of a heating element is disposed out of range of thermal effect of the heating element, and a ceramic capacitor for supplementing the operation of the electrolytic capacitor is additionally disposed between the electrolytic capacitor and the heating element. Accordingly, a long lifespan of the electrolytic capacitor and a stable operation of the heating element can be guaranteed.
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