Method of making a circuit board
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United States of America Patent
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-
Jan 9, 2007
Issued Date -
N/A
app pub date -
Sep 12, 2005
filing date -
Jun 27, 2002
priority date (Note) -
In Force
status (Latency Note)
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Abstract
Provided is a method of forming a circuit board including (a) providing a first conductive sheet; (b) selectively removing one or more portions of the first conductive sheet to form a first panel having a first circuit board that is coupled to a disposable part of the first panel by at least one tab that extends from an edge of the first circuit board to an edge of the disposable part of the first panel; (c) applying an insulating coating to the first circuit board so that at least each edge of the first circuit board is covered thereby; and (d) separating the first circuit board from the disposable part in a manner whereupon at least part of the tab remains attached to the first circuit board and includes an exposed edge of the conductive sheet of the first circuit board. Circuit boards formed by the method are also provided.
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