Method for producing electronic componets
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United States of America Patent
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-
Jan 9, 2007
Grant Date -
Dec 23, 2004
app pub date -
Aug 26, 2002
filing date -
Aug 24, 2001
priority date (Note) -
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status (Latency Note)
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Abstract
A method for producing an electronic component is provided. The method includes providing at least one die on a wafer, the at least one die having at least one sensor-technologically active and/or emitting device on at least a first side; producing at least one patterned support having at least one structure which is functional for the at least one sensor-technologically active and/or emitting device; joining the wafer with the at least one patterned support so that the first side faces the at least one patterned support; and separating the at least one die from the wafer.
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