Methods for integrated implant monitoring
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United States of America Patent
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Jan 9, 2007
Grant Date -
Apr 7, 2005
app pub date -
Jul 19, 2004
filing date -
Jul 21, 2003
priority date (Note) -
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Abstract
The invention relates to a method for real-time in-situ implantation and measurement incorporating a feedback loop to adjust the implantation dose of a substrate during the manufacturing and testing of semiconductor wafers. During processing, the substrate, such as a silicon wafer, is transported between a measuring device and an implantation device multiple times to ensure that where the beam from the implantation device hits the substrate, the doping concentration falls within the range of desired parameters.
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