Single wafer cleaning method to reduce particle defects on a wafer surface
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United States of America Patent
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Jan 16, 2007
Grant Date -
Jul 1, 2004
app pub date -
Dec 15, 2003
filing date -
Dec 16, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Methods of preventing air-liquid interfaces on the surface of a wafer in order to prevent the formation of particle defects on a wafer are presented. The air-liquid interfaces may be prevented by covering the entire surface of the wafer with liquid at all times during a cleaning process while the surface of the wafer is hydrophobic. Methods of preventing the formation of silica agglomerates in a liquid during a pH transition from an alkaline pH to a neutral pH are also presented, including minimizing the turbulence in the liquid solution and reducing the temperature of the liquid solution during the transition.
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