Method for temporarily engaging electronic component for test
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United States of America Patent
Stats
-
Jan 16, 2007
Grant Date -
Apr 13, 2006
app pub date -
Dec 7, 2004
filing date -
Oct 12, 2004
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An electronic socket is described for providing either or both temporary and permanent attachments of electronic components to a substrate having interconnection circuits. The socket includes wells filled with a conductive fluid or paste for temporary attachment to the mesas of an electronic circuit. The wells are connected to selected traces of the substrate having interconnection circuits. The temporary connection may be used to produce known good die (KGD), including support of burn-in and high-speed functional test. The mesas can be filled with a material that is hardened after insertion of the mesas for permanent connection of the electronic circuit to the interconnect circuit.
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