Dielectric composite material
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United States of America Patent
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-
Jan 16, 2007
Grant Date -
Dec 23, 2004
app pub date -
Jun 19, 2003
filing date -
Jun 19, 2003
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A dielectric composite material containing a toughened benzocyclobutene resin and at least about 50% by weight of an inorganic filler. Also electronic packages having at least one conductive layer and at least one layer of the dielectric composite material. The dielectric composite material can have a dielectric constant less than about 3.5, and a dielectric loss of less than about 0.004.
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