Packaging for an interferometric modulator
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United States of America Patent
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Jan 16, 2007
Grant Date -
Nov 17, 2005
app pub date -
May 12, 2004
filing date -
May 12, 2004
priority date (Note) -
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status (Latency Note)
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Abstract
A package is made of a transparent substrate having an interferometric modulator and a back plate. A non-hermetic seal joins the back plate to the substrate to form a package, and a desiccant resides inside the package. A method of packaging an interferometric modulator includes providing a transparent substrate and manufacturing an interferometric modulator array on a backside of the substrate. A back plate is provided and a desiccant is applied to the back plate. The back plate is sealed to the backside of the substrate with a back seal in ambient conditions, thereby forming a package
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