Modular chassis divided along a midplane and cooling system therefor
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 16, 2007
Issued Date -
N/A
app pub date -
Jun 21, 2004
filing date -
Jun 21, 2004
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A chassis divides vertically, with front and rear sections of the chassis joined immediately adjacent a midplane printed circuit board that supports interconnectivity of electronic circuits. Wiring within the chassis is eliminated through directed connections of all components to the midplane. Minimal hardware is required for securing the front and rear sections together, and therefore accessing the midplane for assembly and service is convenient. All components except the midplane are installed and removed from either the front or rear of the chassis without opening or disassembling the chassis. The chassis layout and features facilitate effective cooling of the components in the chassis.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully