Pretreatment solution for providing catalyst for electroless plating, pretreatment method using the solution, and electroless plated film and/or plated object produced by use of the method

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United States of America Patent

PATENT NO 7166152
APP PUB NO 20040043153A1
SERIAL NO

10636447

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Abstract

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A pretreatment solution for providing a catalyst for electroless plating and a pretreatment method using the solution are provided. The pretreatment solution comprises a silver colloidal solution containing, as essential components, at least the following components (I), (II) and (III): (I) silver colloidal particles, (II) one or more ions selected from an ion of a metal having an electric potential which can reduce a silver ion to metal silver in the solution and an ion oxidized at the time of reduction of the silver ion, and (III) one or more ions selected from a hydroxycarboxylate ion, a condensed phosphate ion and an amine carboxylate ion, the silver colloidal particles (I) being produced by the ion of the metal (II) having an electric potential which can reduce a silver ion to metal silver. When an object to be plated is pretreated by use of the pretreatment solution, provision of an effective catalyst for electroless plating is achieved.

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Patent Owner(s)

Patent OwnerAddress
DAIWA FINE CHEMICALS CO LTDAKASHI-SHI HYOGO-KEN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hyun, Kim Dong Akashi, JP 1 13
Kitamura, Shingo Akashi, JP 36 145
Nakao, Seiichiro Kobe, JP 8 31
Nawafune, Hidemi Takatsuki, JP 25 294
Obata, Keigo Akashi, JP 20 339
Okuhama, Yoshiaki Akashi, JP 11 190
Tsuji, Hidenori Fujisawa, JP 18 80
Yoshimoto, Masakazu Akashi, JP 42 688

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