Use of microcapsules in gypsum plasterboards

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United States of America Patent

PATENT NO 7166355
SERIAL NO

10485267

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Abstract

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The invention relates to the use of microcapsules with latent heat storage materials as capsule cores on gypsum plasterboards, gypsum plasterboards containing the same and a method for production thereof.

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Patent Owner(s)

Patent OwnerAddress
MICROTEK HOLDINGS INC2400 E RIVER ROAD DAYTON OH 45439

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Denu, Hans-Jurgen Friedelsheim, DE 12 81
Jahns, Ekkehard Weinheim, DE 61 951
Pakusch, Joachim Speyer, DE 50 391
Schmidt, Marco Mannheim, DE 34 190
Seibert, Horst Fussgoenheim, DE 14 184

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