Continuous metal interconnects
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United States of America Patent
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Jan 23, 2007
Issued Date -
N/A
app pub date -
Sep 28, 2000
filing date -
Sep 30, 1998
priority date (Note) -
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Abstract
A method of forming an interconnection that includes introducing a barrier material in a via of a dielectric to a circuit device on a substrate in such a manner to deposit the barrier material on the circuit device, introducing a seed material into the via in manner that leaves the barrier material overlying the circuit device substantially exposed, substantially removing the barrier material overlying the circuit device, and introducing a conductive material into the via to form the interconnection.
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