Thermal interface apparatus, systems, and methods
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United States of America Patent
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Jan 30, 2007
Grant Date -
Dec 30, 2004
app pub date -
Jun 30, 2003
filing date -
Jun 30, 2003
priority date (Note) -
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Abstract
An apparatus and system, may include a thermal interface material comprised of an array of carbon nanotubes and a buffer layer disposed between the thermal interface material and one of a die or a heat spreader. In some embodiments the carbon nanotubes may be formed above a buffer layer formed above a surface of the heat spreader.
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