Process for making a micro-fluid ejection head structure

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United States of America Patent

PATENT NO 7169538
SERIAL NO

10937968

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Abstract

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A device surface of a substrate is dry-sprayed with a polymeric material (e.g., a photoresist) to provide a spray-coated layer on the surface of the substrate. The spray-coated layer has a thickness ranging from about 0.5 to about 20 microns. Flow features are formed (e.g., imaged and developed) in the spray-coated layer. A nozzle plate layer is applied to the spray-coated layer. The nozzle plate layer has a thickness ranging from about 5 to about 40 microns and contains nozzle holes formed therein to provide the micro-fluid ejection head structure.

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Patent Owner(s)

Patent OwnerAddress
BRADY WORLDWIDE INC6555 WEST GOOD HOPE ROAD MILWAUKEE WI 53223

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bertelsen, Craig M Union, KY 13 73
Hart, Brian C Georgetown, KY 14 86
Holt, Jr Gary A Lexington, KY 2 12
Weaver, Sean T Union, KY 45 121
Williams, Gary R Lexington, KY 29 1127

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