Method of treatment of porous dielectric films to reduce damage during cleaning
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United States of America Patent
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Jan 30, 2007
Grant Date -
Jan 29, 2004
app pub date -
Apr 11, 2003
filing date -
Apr 12, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A device, method, and system for treating low-k dielectric material films to reduce damage during microelectronic component cleaning processes is disclosed. The current invention cleans porous low-k dielectric material films in a highly selectivity with minimal dielectric material damage by first treating microelectronic components to a passivating process followed by a cleaning solution process.
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