Adjusting die placement on a semiconductor wafer to increase yield
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 30, 2007
Grant Date -
N/A
app pub date -
Mar 16, 2004
filing date -
Mar 17, 2003
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A die placement of dice to be formed on a semiconductor wafer is adjusted by obtaining a die placement and one or more locations on the wafer contacted by one or more processing structures or a substance emitted by one or more processing structures. The die placement is adjusted based on the obtained one or more locations on the wafer.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully