Method for manufacturing printed wiring board
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United States of America Patent
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-
Feb 6, 2007
Grant Date -
Jul 6, 2006
app pub date -
Dec 12, 2002
filing date -
Dec 9, 2002
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
There is provided a method for manufacturing a flat printed wiring board in which spaces between circuit patterns are filled with a resin. The method comprises: laminating via a mold release film a plurality of sets of laminated bodies formed by superposing a semi-cured resin sheet on a printed wiring board with circuit patterns formed thereon; placing the laminated plural sets of the laminated bodies interposed between a pair of smoothing plates and collectively pressing the laminated bodies in a reduced pressure atmosphere used for curing the resin; and then polishing the cured resin covering the circuit patterns, thereby exposing the circuit patterns.
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