Sn-Zn lead-free solder alloy, and solder junction portion
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United States of America Patent
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Feb 13, 2007
Issued Date -
N/A
app pub date -
May 12, 2006
filing date -
Aug 23, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An Sn--Zn lead-free solder alloy according to the present invention is constructed in a manner such that it is an Sn-based solder alloy indispensably containing 6 to 10 wt % zinc at least and further containing 0.0015 to 0.03 wt % magnesium and 0.0010 to 0.006 wt % aluminum. Upon preservation of solder paste not only under refrigeration but also at a room temperature or higher, the inside of solder particle is protected by the protective magnesium/aluminum oxide film formed on the solder particle surface, and a reaction between zinc and an activator is suppressed, so that preservation stability is improved, and at the elevated temperature during soldering, the solder alloy enters a state where said protective oxide film is easily destroyed, so that good wettability is held.
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