Microelectronic packages and methods therefor
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United States of America Patent
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Feb 13, 2007
Issued Date -
N/A
app pub date -
Dec 16, 2004
filing date -
Dec 30, 2003
priority date (Note) -
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Abstract
A microelectronic package includes a microelectronic element having faces and contacts and a flexible substrate spaced from and overlying a first face of the microelectronic element. The package also includes a plurality of conductive posts extending from the flexible substrate and projecting away from the first face of the microelectronic element, wherein at least some of the conductive posts are electrically interconnected with the microelectronic element, and a plurality of support elements supporting the flexible substrate over the microelectronic element. The conductive posts are offset from the support elements to facilitate flexure of the substrate and movement of the posts relative to the microelectronic element.
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